? 1 ? e02748-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. CXG1144EN 10 pin vson (plastic) high power dpdt switch with logic control description the CXG1144EN is a high power dpdt switch mmic. this ic can be used in wireless communication systems, for example, cdma handsets with gps. the CXG1144EN can be operated by one cmos control line. the sony's j-fet process is used for low insertion loss and on-chip logic circuit. features ? low insertion loss: 0.30db @900mhz, 0.45db @1900mhz high linearity: iip3 (typ.) = 65dbm 1 cmos compatible control line small package size: 10-pin vson applications dual-band cellular handsets cdma with gps, dual-band cdma structure gaas j-fet mmic absolute maximum ratings (ta = 25c) bias voltage v dd 7v control voltage vctl 5 v operating temperature topr ?35 to +85 c storage temperature tstg ?65 to +150 c gaas mmics are esd sensitive devices. special handling precautions are required.
? 2 ? CXG1144EN block diagram and terminal arrangement figure truth table f4 off on f3 on off f2 off on f1 on off ctl l h on state rf1 ? rf2, rf3 ? rf4 rf2 ? rf3, rf4 ? rf1 6 7 8 9 10 5 4 1 2 gnd (recommended) gnd (recommended) v dd 3 logic rf2 gnd gnd f3 f1 f2 f4 rf1 ctl rf3 gnd gnd rf4 v dd off state rf2 ? rf3, rf4 ? rf1 rf1 ? rf2, rf3 ? rf4 pin description 1 pin no. 1 2 3 4 5 6 7 8 9 10 description control signal input rf signal input gnd gnd rf signal output rf signal input gnd gnd rf signal output power supply input ctl rf1 gnd gnd rf2 rf3 gnd gnd rf4 v dd symbol
? 3 ? CXG1144EN pin description 2 1 logic 10 f1 to f4 pin no. symbol equivalent circuit 1 ctl 10 v dd item vctl (h) vctl (l) v dd min. 2.0 0 2.7 ty p. 3.0 ? 3.0 max. 3.6 0.4 3.6 unit v v v dc bias condition (ta = 25 c)
? 4 ? CXG1144EN electrical characteristics (ta = 25 c, v dd = 3.0v) unit db db db db ? dbc dbc dbc dbc dbm dbm dbm s a a max. 0.55 0.70 ? 60 ? 60 ? 60 ? 60 5 200 100 ty p. 0.30 0.45 21 16 1.2 ? 75 ? 75 ? 75 ? 75 65 65 35 1 55 40 min. 18 14 55 55 32 condition 900mhz 1.9ghz 900mhz 1.9ghz 50 ? ? 1 ? 3 ? 1 ? 3 ? 2 ? 4 v dd = 2.8v v dd = 3.0v vctl (h) = 3v symbol il iso. vswr 2fo 3fo iip3 p1db tsw i dd ictl item insertion loss isolation vswr harmonics input ip3 1db compression input power switching speed bias current control current condition ? 1 pin = 25dbm, 0/3v control, v dd = 3.0v, 900mhz ? 2 pin = 25dbm (900mhz) +25dbm (901mhz), 0/3v control, v dd = 3.0v ? 3 pin = 25dbm, 0/3v control, v dd = 3.0v, 1.9ghz ? 4 pin = 25dbm (1.9ghz) +25dbm (1.901ghz), 0/3v control, v dd = 3.0v
? 5 ? CXG1144EN when using this ic, the following external components should be used: rctl: this resistor is used to improve esd performance. 1k ? is recommended. c rf : this capacitor is used for rf de-coupling and must be used for all applications. 100pf is recommended. cbypass: this capacitor is used for dc line filtering. 100pf is recommended. electrical characteristics measurement circuit 6 7 8 9 10 rf2 gnd gnd c rf (100pf) ctl cbypass (100pf) rf1 c rf (100pf) v dd cbypass (100pf) rf3 gnd gnd c rf (100pf) rf4 c rf (100pf) 5 4 1 2 rctl (1k ? ) gnd (recommended) gnd (recommended) 3
? 6 ? CXG1144EN typical characteristics 0 0.5 1.0 1.5 insertion loss [db] 2.0 2.5 3.0 0 0.5 1.0 frequency [ghz] 1.5 2.0 frequency vs. insertion loss 0 10 5 20 15 isolation [db] 30 25 40 45 35 50 0 0.5 1.0 frequency [ghz] 1.5 2.0 frequency vs. isolation
? 7 ? CXG1144EN sony corporation package outline unit: mm 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 10pin vson(plastic) vson-10p-01 0.15 s b a 2.5 2.7 2.5 0.4 b 0.15 s b a 0.05 m s ab x2 x4 s s 0.6 0.5 0.2 0.8 15 6 10 0.35 0.1 0.35 0.1 0.8 ? 0.05 + 0.1 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 ? 0.03 0.13 0.025 + 0.09 (stand off) 0.03 0.03 pin 1 index 0.013g ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the lead specifications item lead material copper alloy lead treatment sn-bi 2.5% lead treatment thickness 5-18m spec.
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